The partnership will ensure the implementation of the initiative through several consecutive Specific Grant Agreements (SGAs) that will carry out the different activities in a common framework. The SGAs will be implemented as Research and Innovation Actions (RIA) or Innovation Actions (IA) in function of the concrete objectives of the action. The FPA should be carried out in different phases, which will be triggered after the attainment of appropriate intermediate progress milestones identified by the Consortia. The FPA will permit the coordinated development of the technology, its validation and the nurturing of the ecosystem. The developments should be integrated in at least one pilot demonstrator to validate the developments and demonstrate the scalability potential.

The infrastructures of the pilot line should be installed in a pre-operational environment in the facilities of the hosting entities. The FPA and SGAs should target delivering components for building and deploying in the EU of quantum technologies based on European technology.

Proposals should address the following activities:

• Integrating fabrication capabilities into mainstream microelectronics or photonics manufacturing processes.
• Microfabrication techniques adaptable for high-yield production of next-generation ion-traps.
• Process design kits (PDKs) for fabricating next-generation ion-traps using standardized building blocks. Integrating cutting-edge PDKs with European virtual design platforms to standardize production and reduce the need for custom developments.
• Integration of advanced features such as segments and junctions, and integrated photonics for addressing, manipulation, and readout in ion-trap chips.
• Enhancing technology (including enabling technologies) and manufacturing readiness levels across the quantum industry, addressing applications in one or more of the following: quantum computing, communications, simulation, and/or sensing.
• Standardisation of production processes and development of high-quality ion-traps for diverse applications including quantum computing, quantum communication, quantum metrology, and quantum simulation.
• Demonstration of scalable, efficient, and stable (e.g. high yield) production capabilities. The development of robust and repeatable manufacturing processes tailored to quantum chips’ unique requirements, enabling a consistent and reliable supply for European stakeholders.
• Developing reliable characterization tools to ensure quality assurance of trapped-ion chips, ensuring consistency and reliability across production batches, and demonstrating the scalability of pilot line technologies from small-to-mid volume fabrication to potentially large-scale industrial production.
• Define a technology roadmap and implementation plan towards industrialisation of the production of quantum chips.

Budget: Proposals are expected to indicate an overall budget for the implementation of a full FPA via multiple SGAs. At most 1 FPA proposal is expected to be selected. The JU estimates that an EU contribution of up to € 15.000.000 for a first SGA would allow starting the expected outcomes to be addressed appropriately. Nonetheless, this does not preclude submission and selection of an FPA proposal indicating different amounts for a first SGA.