The partnerships will be set up through one FPA per technology platform, which will ensure the implementation of the initiative through several consecutive Specific Grant Agreements (SGAs) that will carry out the different activities in a common framework. The SGAs will be implemented as Research and Innovation Actions (RIA) or Innovation Actions (IA) in function of the concrete objectives of the action. The FPAs should be carried out in different phases, which will be triggered after the attainment of appropriate intermediate progress milestones identified by the consortia. The FPAs will permit the coordinated development of the technology, its validation and the nurturing of the ecosystem. The developments should be integrated in one pilot demonstrator per FPA to validate the developments and demonstrate the scalability potential.

The FPAs are expected to achieve Technology Readiness Level (TRL) 8. The actions implemented under the first SGA are expected to achieve Technology Readiness Level (TRL) 6.

Proposals should address the following activities:

• Developing scalable production processes for quantum chips in view of building industrial production processes.
• Integrating cutting-edge Quantum Process Design Kits (PDKs) with European virtual design platforms to standardize production and reduce the need for custom developments.
• Enhancing technology (including enabling technologies) and manufacturing readiness levels across the quantum industry, addressing applications in one or more of the following: quantum computing, communications, simulation, and/or sensing.
• Establishing standardized methodologies for the design, test, and manufacturing of quantum chips to streamline production processes and broaden the application sectors.
• Demonstration of scalable, efficient, and stable production capabilities, aiming at high yield. The development of robust and repeatable manufacturing processes tailored to quantum chips’ unique requirements, enabling a consistent and reliable supply for European stakeholders.
• Developing reliable characterization tools to ensure quality assurance of quantum chips, ensuring consistency and reliability across production batches, and demonstrating the scalability of pilot line technologies from small-to-mid volume fabrication to potentially large-scale industrial production.
• Define a technology roadmap and implementation plan towards industrialisation of the production of quantum chips.

Proposals are expected to indicate an overall budget for the implementation of a full FPA via multiple SGAs. In case of sufficient high-quality proposals submitted and evaluated, at least 2 FPA proposals are expected to be selected.