Heterogeneous Integration for High-Performance Automotive Computing

Opened

Programme Category

EU Competitive Programmes

Programme Name

Chips Joint Undertaking (Chips JU)

Programme Description

The Chips Joint Undertaking (Chips JU) is a pioneering initiative committed to catalysing research, development, and manufacturing capabilities across Europe. In this section, we delve into the key facets of Chips JU and its mission to shape the semiconductor future of the European Union.

The Chips Joint Undertaking (JU) supports research, development, innovation, and future manufacturing capacities in the European semiconductor ecosystem.

Programme Details

Identifier Code

HORIZON-JU-CHIPS-2025-IA-HPA

Call

Heterogeneous Integration for High-Performance Automotive Computing

Summary

The Chips JU has in the last couple of years supported several projects on heterogenous integration. The present call is, amongst other objectives, also meant to translate the results of those previous calls into process workflows (TRL 7-8). Implementation of the developed workflows will be integrated in the call on RISC-V hardware platform. This will require a close collaboration between the two consortia that will be enforced when preparing the grants.

Detailed Call Description

Proposals are expected to encompass at least the following elements:

  • Automotive chiplet system framework: Develop and implement the architectural and design specifications for an automotive chiplet-based computing platform, taking into consideration any relevant standards and industry wide collaborations in this field.
  • Adaptation of relevant IP: Where necessary, adapt pertinent intellectual property (IP) to support seamless chiplet integration within the automotive context.
  • Automotive base die development: Development of an automotive base die for the orchestration of in-package computing with adequate process workflows.
  • System Integration and Packaging: integrate the system and develop the package taking into consideration automotive requirements.

Complementarity with the RISC-V Automotive Hardware Platform topic is expected. For the purposes of intermediate physical demonstrators, non-RISC-V based IP may be considered for in-package integration. Collaboration with the Chips for Europe Initiative pilot lines is encouraged. Nevertheless, the final deliverable for this project should include components developed under the RISC-V Automotive Hardware Platform call – particularly the application processor and AI accelerators – integrated with other IP via the chiplet platform developed under this call.

Proposals submitted to this call should address heterogeneous integration and interfacing components with special emphasis on 2.5D integration through chiplets. The developments under this initiative, while purely pre-competitive in nature, should have a clear perspective towards eventual commercialisation by European industry. The results shall include tangible silicon demonstrators that can be deployed in an operational environment as qualified devices. Proposals submitted to this call should clearly target the requirements of the European automotive industry. Where appropriate, proposals submitted in response to this call should consider the potential application of the aforementioned elements in other industry verticals.

Proposals should present an action plan that addresses the different outcomes elaborated below with significant milestones clearly indicated for each outcome. The selected proposals for the present call and the call on the RISC-V Automotive Hardware Platform must align their activities, roadmaps, milestones, transfer of results and IP, etc. to realise the required demonstrators.

Call Total Budget

€20.000.000

Financing percentage by EU or other bodies / Level of Subsidy or Loan

The Chips JU estimates that an EU contribution of between €1.000.000 and €2.000.000 per project would allow these outcomes to be addressed appropriately.

The maximum EU Contribution as percentage of the eligible cost for this topic is:

  • For profit organization but not an SME- 25%
  • SME (for profit SME) – 35%
  • University/Other (not for profit) – 35%

For the partners of a Participating State that coordinates grants, specific rules may apply regarding the eligibility to national funding.

Thematic Categories

  • Education and training
  • Research, Technological Development and Innovation
  • Small-Medium Enterprises and Competitiveness

Eligibility for Participation

  • Educational Institutions
  • Non Profit Organisations
  • Other Beneficiaries
  • Private Bodies
  • Researchers/Research Centers/Institutions
  • Small and Medium Enterprises (SMEs)

Eligibility For Participation Notes

There are specific eligibility criteria relevant to each Participating State listed in the Chips Joint Undertaking (Chips JU) Work Programme 2023-2025.

Consortia submitting applications to this call should be inclusive, incorporating the relevant stakeholders across the microelectronics and automotive value-chain such as Integrated Device Manufacturers (IDMs), automotive Original Equipment Manufacturers (OEMs) and Tier 1 suppliers and if relevant Research and Technology Organisations (RTOs). Furthermore, consortia should include credible start-ups and SMEs that have the potential of exploiting the results of the projects under this call and develop into European champions. A consortium with around 15 participants (or less) should be able to cover all the required tasks.

Eligibility criteria are described in Annex 1 band Annex 4 (National/Regional specific eligibility conditions) of the Chips Joint Undertaking (Chips JU) Work Programme 2023-2025.

For detailed information about the eligibility conditions for each call, please visit the Chips Joint Undertaking (Chips JU) Work Programme 2023-2025.

Call Opening Date

04/03/2025

Call Closing Date

29/04/2025

EU Contact Point