Proposals are expected to address all the following:

• System-partitioning/-integration: Intelligent, redundant and fail-safe topology/system architecture, highly integrated power electronics with component integration and building-block approaches for minimal level of parasitics, integration and functional modularity of power converters.
• Circuit concepts and control: Topologies adapted to advanced WBG semiconductors and new materials, “including & beyond GaN”, control approaches for improved reliability as well as reduction of losses, noise and interference at a system level, novel control strategies with self-learning and intelligent monitoring capabilities, suitable for very high-frequency operation.
• Interconnected technologies: robust assembly and materials, better suited for integration and new power semiconductors, alongside the capability for higher temperatures and currents, as well as extension to 3D design.
• Joining and connecting technologies: Power output stages with low impedance connection and increased robustness against temperature cycling, as well as advanced interfaces for modular building blocks.
• Thermal management: Module and component concepts with improved thermal performance, concepts for integrating cooling in housings, assemblies and component groups, and with environmental control if appropriate, direct liquid-cooling for high power can be considered through different solutions, extension of air-cooling up to medium power levels.
• Simulation/Prediction: Holistic simulation chain, advanced physics-based simulation tools/models to increase development capabilities in order to close the gap to physical limits and reduce overengineering, prediction of functional availability dynamically during operation predictive maintenance.
• Gate Drivers: integration of the driver component with the power module to limit the stray inductance between the gate driver and the semiconductor, the gate driver should allow maximum switching speed by dealing with electromagnetic interferences (EMI) to drive wide bandgap devices.